DS200ADGIG1AAA processor board

(1) PB-OEM1-SHO is an upgraded product of PB-OEM1-DPRAM, with completely identical technical specifications except for different definitions of sockets and pins.
P B O E M 1 D P R A M board size: 50 m m m x 70 m m. 2 x 20 feet spacing 2 0 m m socket.
P B O E M 1 S H O board size: 50 m m m x 70 m m. 2 x 20+2 x 5 foot spacing 2 0 m m socket.
(2) Standard P R O F I B U S D P driver interface, compliant with E N 5 7 1 70 V 2 and I E C 6 1 15 8 baud rate adaptation, with a maximum baud rate of 12 M;
(3) The number of inputs/outputs for P R O F I B U S can be freely set, with a maximum of 112 byte inputs and 112 byte outputs;
(4) Can achieve P R O F I B U S user parameterization function: User templates can set one-time parameters in the main station configuration, such as temperature upper limit alarm values, etc; The master station transmits these user parameters to the slave station at once when connecting with the slave station, and the user template can use these parameters to achieve parameterization. The benefit of user parameterization function is to avoid using one-time set parameters as P R O F I B U S I/O, which occupies periodic data communication time and space resources;
(5) The interface between the interface board and the user board is a dual port RAM (25 ns read/write cycle), and the user board can operate the interface board according to the normal RAM read/write timing;
(6) The interface board and user board exchange data between the dual port RAM through mutual interruption and hardware handshake, ensuring the real-time and integrity (consistency) of data exchange;
(7) The data exchange between the interface board and the user template has a word checksum, ensuring data security:
(8) Two sets of DC 5 V ± 5% power supply are required for the user board: V C C/G N D -150 mA and 5 V/0 V -100 mA;
(9) Environmental temperature: Transportation and storage: -40 ℃~+70 ℃ Working temperature: -20 ℃~+55 ℃ Working relative humidity: 5~95%

DS200ADGIG1AAA processor board

The main characteristics of embedded system devices are high reliability, diverse forms, and complex usage environments. Therefore, the selection of core control components needs to fully consider their physical reliability in combination with practical applications.

Compared with the X86 platform, ARM has natural low-power characteristics and can adopt either non cooling or passive cooling solutions. It also supports embedded operating systems such as WinCE, which greatly improves reliability.

Therefore, this article focuses on discussing ARM based embedded systems; At the same time, with the development of ARM chips and embedded devices, their design complexity and process difficulty are also increasing.

Adopting core modular design can simplify design and production difficulty. From the development of many embedded fields such as instruments and automobiles abroad, modular design is gradually being widely adopted. So, can the use of ARM core modules lead to a decrease in system reliability? Below, we will analyze the interface form, fixed methods, and specific testing examples.

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