DS200ADPAG1 communication module

*Fanless Design

*Default Intel Celeron M 1.5GHz up to Pentium M 1.8GHz CPU
*19″High Brightness (300cd/m) TFT LCD with resolution of 1280*1024

*Optional GFG Resistive screen
*Optional optical bonding for Sunlight readable solution
*Aluminum (10mm) bezel and Stainless steel housing (Anti-Corrosion Coating)
*Support 1*SO-DIMM up to 1GB DDR SDRAM
*Support 1*CD-ROM on the back side (optional)
*Support 1*2.5 HDD space
*AC universal power input,optional DC 11~32V power input

Basic features:
Intel Atom? N2600 (optional N2800 processor)
Intel NM10
DDR3 1xSO-DIMM, Supports up to 2GB (N2800 supports 4GB), DDR3 800/1066MHz
Gigabit Ethernet x 2
VGA, HDMI,LVDS
On board independent display chip AMD HD7410M, on board 512M graphics memory
SATA 2 x 2
USB 2.0 x 6, COM x 4, 8-bit digital I/O
Mini Card x 2,1x SIM card slots

DS200ADPAG1 communication module

The main characteristics of embedded system devices are high reliability, diverse forms, and complex usage environments. Therefore, the selection of core control components needs to fully consider their physical reliability in combination with practical applications.

Compared with the X86 platform, ARM has natural low-power characteristics and can adopt either non cooling or passive cooling solutions. It also supports embedded operating systems such as WinCE, which greatly improves reliability.

Therefore, this article focuses on discussing ARM based embedded systems; At the same time, with the development of ARM chips and embedded devices, their design complexity and process difficulty are also increasing.

Adopting core modular design can simplify design and production difficulty. From the development of many embedded fields such as instruments and automobiles abroad, modular design is gradually being widely adopted. So, can the use of ARM core modules lead to a decrease in system reliability? Below, we will analyze the interface form, fixed methods, and specific testing examples.

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